Process procedure:soldering block ---- Install the driver board ---- Put a plate ----adjust board --- gluing --- curing --- aging test ---- packaging
Update：2015-05-22 Browse：
Process procedure：wire wrapping ---- Welding fixed -----Put the box ---- adjustable ----- gluing ---- curing --- aging test ---- packaging
Update：2015-05-22 Browse：
Process procedure：Material preparation ---- soldering -----preliminary test ---- glue pouring to keep waterproof ---- aging ---- clear glue ---- final test ---- Stick nameplate ---- inspection--- packaging and storage
Update：2015-05-22 Browse：
Process procedure：Install PCB----Soldering ----adjust PCB---Gluing ---Curing ---aging test ----packaging
Update：2015-04-29 Browse：
Process procedure：Soldering block ---- put plate --- first gluing ----put plate--- adjust plate --- second gluing --- vacuuming------ curing ---- aging test ---- packaging
Update：2015-05-22 Browse：
Process procedure：Soldering block ---- Installation box ---- First gluing --- Put plate---adjust plate ---- second gluing --- Curing--- aging test ---- packaging
Update：2015-05-22 Browse：
Process procedure：soldering block ---- put the box --- put the plate --- adjust plate--- gluing --- curing --- aging test --- packaging
Update：2015-05-22 Browse：
Process procedure：Basilemma ----- Steamed metallized layer-----slitting ----- winding----zinc spray ----- energize -----bonding lead ---- gluing ----close over ----test and packaging
Update：2015-05-22 Browse：
Process procedure：wire wrapping -----Welding fixed ------ put box ----adjustable ---- gluing --- curing ----aging test----packaging
Update：2015-05-22 Browse：
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