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Power module glue dispensing video

Update:2015-06-01 Browse:

Power supply module can be directly mounted on the printed circuit board, power supply, its characteristic is to application-specific integrated circuit (ASIC), digital signal processor (DSP), microprocessor, memory, field programmable gate array (FPGA) and other digital or analog load to provide power supply .

Adhesive Characteristic

Glue type : Epoxy

Feature : low price glue with high additive and effected by climate

Main ratio : 5:1、10:1、3:1

Curing condition: Accurate ratio and stirring evenly

Glue dispensing requirement : Good curing effects without effected by climate . Accurate glue output Stable machine can use general glue

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